Data Communications
The use of thick gold or precious metals on high performance connectors requires an unsustainable mining footprint that can be mitigated by reduction or replacement of these materials. As the world continues to create more devices and build out more enterprise servers this issue becomes more acute. Today new solutions for data communications thin gold board to board connectors are being explored using XTALIC’s proven advanced material design platform based on computational models from the labs at MIT.
Downloads
Thick gold is used to overcome porosity in nickel barrier layers for high performance data communications connectors.
A standard plated part using 3x the required gold that Xtalic connectors use.
In corrosion testing the thick gold protects the contact area but exposed nickel corrodes.
XTRONIC® provides contacts the same protection with 1/3 the gold while exposed XTRONIC® survives.
Learn How To Transform Your Products
LUNA® is one of the strongest highest temperature silver alloys in the world. As the automotive industry moves fleets from ICE to EV platforms, the powertrain performance, safety, and reliability is provided through advanced electronic material technologies that enable a longer life and higher operating temperatures.
As electronics move from our smartphone to our bodies through wearable or medical devices, the materials used are required to be safer. LUNA® enables the removal of nickel from charging contacts.
As smartphones shift to higher charging potentials and waterproofing claims, the USBC charging connector requires high performance advanced material technologies. XTRONIC® is a cornerstone for more than 2 billion smartphones that have fast charge waterproof features. These solutions are being explored across new applications as the world moves to electrify bikes, medical devices, and wearables.
