Xtalic Nanostructured Nickel-Gold Alloy
Our new patented, nanostructured nickel-gold (Ni-Au) alloy is specifically designed for use in the manufacture of crucial electrical contacts where high conductivity and strength must be maintained at elevated temperatures.
The new nickel-gold alloy is ideal for fine pitch interconnects that require superior strength, durability, and conductivity while being exposed to high temperatures. Features include:
- Strength up to 2,000 MPa
- Resistivity down to 12 µΩ-cm
- More than 1,000 MPa fatigue life at temperatures up to 400oC
Xtalic nickel-gold alloy uses a small amount of gold to control the nickel grain size, create a thermodynamically stable super-saturated solid solution, and find the optimal balance of electrical and mechanical properties. The alloy fulfills the need for high-current-carrying miniaturized electrical contacts in applications throughout the consumer electronic, automotive, and semiconductor industries.
The result is a new nanostructured nickel-gold alloy that enables fine-pitch interconnects to carry more current…
… while maintaining strength at higher temperatures.
Put Xtalic to work with your designers to custom-tailor nickel-gold properties to meet your specific challenges across a variety of other applications — delivered in rapid turn-around and economically — by leveraging our Dynamic Nanostructure Control® and patented Rapid Alloy Design toolkits.