Precious Metal Reduction
Xtalic designs contact surface solutions that deliver equivalent or better performance while providing a lower precious metal expense.
XTRONIC® is our high wear nanostructured alloy. It provides excellent substrate protection, so less precious metal is required for high performance. Our customers typically save 40% or more of their expense from precious metal.
Gold is commonly used on connectors to provide a low-resistance, stable electrical connection. A nickel barrier layer is needed for additional corrosion protection to improve durability and to prevent interdiffusion between gold and copper. XTRONIC®, when used as a barrier layer, is a more corrosion- and wear-resistant solution, allowing the use of less gold at the contact interface.