Our Advanced Materials
Xtalic’s advanced materials are strategically created using our patented computational material design platform based on groundbreaking scientific research at the Massachusetts Institute of Technology. Our nanostructured metal alloys are single-phase, super-saturated, solid-solutions — produced using our proprietary electrodeposition techniques — and maintain their supercharged properties with a stable nanostructure.
Nanostructured Soft Magnetic Alloy
XENERGY enhances wireless charging performance by optimizing inductance, reducing AC resistance, and improving magnetic properties, making it a more efficient solution for high-frequency applications where minimizing energy loss and heat is essential.
Magnetic Features
- Permeability u>20
- Tan d (loss) at frequency: low
- Inductance boost: up to 200%
Plating Layer Parameters
- Thickness 0.1 – 5 um
- Alloy composition: Ni-Fe-Co-X
Electrical Properties
- DC resistivity ~ 20-500 µΩ cm (selectable)
- AC resistivity drop at high frequency
Applications
- Consumer Electronics
- Medical Devices
- High-frequency Inductors
Nanostructured Palladium
PALLEX® delivers a high-performance connector finish with low contact resistance, superior durability, and corrosion stability, offering a cost-effective, eco-friendly alternative to traditional precious metals for consumer electronics and high-performance connectors.
Key Features
- Hardness of 550-650 HV for enhanced durability in mechanical interfaces.
- Value-based powered immersion corrosion performance that competes with Platinum.
- Thermal stability of up to 300°C
- Pallex can be manufactured with 100% recycled palladium.
Manufacturing Methods
- Reel-to-reel
- Barrel and Rack
Applications
- Consumer Electronics
- Wearable Technology
Nanostructured Silver
Key Properties
- Hardness ~2GPa (2-3x Pure Ag)
- CoF µ = .7 [.2 w/Lube]
- Thermal Stability ~ 225 C
- Electrical Resistivity ~ 4 µΩ cm
Resources
Manufacturing Methods
- Pulse Reverse Electrodeposition
- Barrel and Rack
- Cyanide-free
Applications
- Electric Vehicles
- Safe Wearables Nickel Free
- Thin Gold Replacement
Nanostructured Nickel
Key Properties
- Hardness 650 HV – 700 HV (HT 900 HV)
- Thermal Stability ~ 500 C
- Conductivity 10-15 W/(mK)
Resources
Manufacturing Methods
- Pulse Reverse Electrodeposition
- Reel to Reel, Barrel, and Rack
- Solution Based Chemistry Replenishment w/ Insoluble SS Anode
Applications
- Waterproof Smartphones
- Precious Metal Reduction
- Electric Vehicles
Nanostructured Aluminum
Key Properties
- Mechanical Elongation > 8%
- Yield Strength > 500 MPa
- Thermal Stability ~ 300 C
- Thermal Conductivity ~50W/m-K
- Thickness Range: 1nm – 1mm Thick
- Conductivity ~10% IACS
- Ecorr = -0.4V
- B117 NSST > 3000 hours
Manufacturing Methods
- Pulse Reverse Electrodeposition
- Barrel and Rack
- Ionic Liquid with Soluble Anodes
Applications
- Lightweighting
