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Our Advanced Materials

We provide advanced materials for more than half of the top ten consumer electronic OEMs in the market who are shaping the future of next-generation devices.
Key Properties
  • Hardness 650 HV – 700 HV (HT 900 HV)
  • Thermal Stability ~ 500 C
  • Conductivity 10-15 W/(mK)
Manufacturing Methods
  • Pulse Reverse Electrodeposition
  • Reel to Reel, Barrel, and Rack
  • Solution Based Chemistry Replenishment w/ Insoluble SS Anode
Applications
Resources
Key Properties
  • Hardness ~2GPa (2-3x Pure Ag)
  • CoF µ = .7 [.2 w/Lube]
  • Thermal Stability ~ 225 C
  • Electrical Resistivity ~ 4 µΩ cm
Manufacturing Methods
  • Pulse Reverse Electrodeposition
  • Barrel and Rack
  • Cyanide-free
Applications
Resources
Key Properties
  • Mechanical Elongation > 8%
  • Yield Strength > 500 MPa
  • Thermal Stability ~ 300 C
  • Thermal Conductivity ~50W/m-K
  • Thickness Range: 1nm – 1mm Thick
  • Conductivity ~10% IACS
  • Ecorr = -0.4V
  • B117 NSST > 3000 hours
Manufacturing Methods
  • Pulse Reverse Electrodeposition
  • Barrel and Rack
  • Ionic Liquid with Soluble Anodes
Applications
  • Lightweighting