Skip to main content

Our Advanced Materials

We provide advanced materials for more than half of the top ten consumer electronic OEMs in the market who are shaping the future of next-generation devices.
Key Features
  • Hardness of 550-650 HV for enhanced durability in mechanical interfaces.
  • Value-based powered immersion corrosion performance that competes with Platinum.
  • Thermal stability of up to 300°C
  • Pallex can be manufactured with 100% recycled palladium.
Manufacturing Methods
  • Reel-to-reel
  • Barrel and Rack
Applications
  • Consumer Electronics
  • Wearable Technology

Learn more

Key Properties
  • Hardness ~2GPa (2-3x Pure Ag)
  • CoF µ = .7 [.2 w/Lube]
  • Thermal Stability ~ 225 C
  • Electrical Resistivity ~ 4 µΩ cm
Manufacturing Methods
  • Pulse Reverse Electrodeposition
  • Barrel and Rack
  • Cyanide-free
Applications
Resources
Key Properties
  • Hardness 650 HV – 700 HV (HT 900 HV)
  • Thermal Stability ~ 500 C
  • Conductivity 10-15 W/(mK)
Manufacturing Methods
  • Pulse Reverse Electrodeposition
  • Reel to Reel, Barrel, and Rack
  • Solution Based Chemistry Replenishment w/ Insoluble SS Anode
Applications
Resources
Key Properties
  • Mechanical Elongation > 8%
  • Yield Strength > 500 MPa
  • Thermal Stability ~ 300 C
  • Thermal Conductivity ~50W/m-K
  • Thickness Range: 1nm – 1mm Thick
  • Conductivity ~10% IACS
  • Ecorr = -0.4V
  • B117 NSST > 3000 hours
Manufacturing Methods
  • Pulse Reverse Electrodeposition
  • Barrel and Rack
  • Ionic Liquid with Soluble Anodes
Applications
  • Lightweighting

Introducing PALLEX® a nanostructured palladium alloy for connector final finish

X