Waterproofing/Corrosion Protection

Xtalic designs high performance metal solutions for environment facing electrical contact surfaces. When compared to standard industry gold or equivalent products, the life of mobile electronics when exposed to immersion, spills and sweat is extended by up to a factor of 30.

IC Plus™ is an engineered multilayer stack that extends performance life by more than a factor of 20 in the most demanding environments.

IC Max™ is our highest performing engineered multilayer stack that extends performance life by more than a factor of 30.

Mobile and wearable devices are at constant risk from exposure to spilled liquids or sweat. Therefore, connector corrosion protection is a key feature when producing water resistant mobile devices. While gaskets are able to protect the interior, the metal contacts in the connectors that are exposed to these elements can quickly corrode leaving the device unable to charge. As devices move toward faster charging capabilities, this issue becomes more acute. Xtalic uses proprietary alloys and multilayer coatings in order to protect mobile device connectors from corrosion.

Corrosion Examples

USBc Connectors
Prior to Test

Industry Standard
0.75μm Au/Ni

IC Plus

Immersion Corrosion (Artificial Perspiration @ 5 Volts) + Durability

Industry Standard
0.75μm Au/Ni

2 cycles = Corrosion breakthrough to substrate
5 cycles = Significant corrosion and wear damage to VBUS pins

IC Plus

45 cycles = No corrosion or wear damage to VBUS pins